http://www.flex007.com/ PCB fabricator news from around the world: FLEX007 - features Printed Electronics are being developed by over 3,000 companies, universities and research institutes worldwide. Although a significant percentage of these developers are located in the U.S., Germany, Japan and South Korea, there's a lot of research effort in other countries, even if the concentration of active companies active is lower. http://www.flex007.com/pages/zone.cgi?a=71053 Wed, 08 Sep 2010 13:08:00 GMT Enthone's research has focused on providing a solderable surface finish for PCBs containing organic nanometal. The first universal nanofinish was proposed four years ago. Now, the new-generation nanofinish with organic metal-Ag complex performs as well as any other surface finish with regard to aging resistance, discoloration and solderability. http://www.flex007.com/pages/zone.cgi?a=70948 Sat, 04 Sep 2010 13:58:00 GMT In this week's PCB Asia Week, the PCB industry looks very active, with companies such as TECHWISE Circuits increasing their technical know-how, while others, including TUC, ramp up their exports. Chunghong, on the other hand, is raising capital through a listing on the TSE. http://www.flex007.com/pages/zone.cgi?a=71050 Fri, 03 Sep 2010 14:01:00 GMT Enthone Inc., a business of Cookson Electronics, has introduced ENTEK OM. The patented Organic Metal process delivers a visible, highly conductive PWB final finish that offers both ease of inspection and in-circuit testing (ICT). http://www.flex007.com/pages/zone.cgi?a=70996 Thu, 02 Sep 2010 10:52:00 GMT Today's video equpment operates at gigabit rates, necessitating the use of large coaxial BNC connectors. Non-optimized BNC footrpints can cause impedance mismatches, reflections and signal loss. In this paper, Tsun-kit Chin of National Semiconductor discusses some common issues with BNC footprints, such as problems with the connector-to-board transition, and offers techniques for transparent footprint designs. http://www.flex007.com/pages/zone.cgi?a=70992 Wed, 01 Sep 2010 21:06:00 GMT We live in a service-driven society. It's a big market out there, and we can accept or reject products or services as we see fit. So, it's really darn important for a company selling a product or service to provide customer service at a standard that meets (or exceeds) the consumer's expectations. http://www.flex007.com/pages/zone.cgi?a=70983 Wed, 01 Sep 2010 15:14:00 GMT Global sales of semiconductors grew to $25.2 billion in July, an increase of 1.2% from June when sales were $24.9 billion and an increase of 37% from July 2009 when sales were $18.4 billion, the SIA reported. Year-to-date sales total $169.2 billion, an increase of 46.7% from the $115.3 billion reported for the first seven months of 2009. http://www.flex007.com/pages/zone.cgi?a=70899 Mon, 30 Aug 2010 12:05:00 GMT Compared to the previous year, the PCB Division increased its net proceeds during the period by 27.3% to CHF 17.8 million (first half of 2009: CHF 14.0 million); During the period, the ES Division achieved net proceeds of CHF 44.8 million (first half of 2009: CHF 41.5 million). http://www.flex007.com/pages/zone.cgi?a=70863 Fri, 27 Aug 2010 11:46:00 GMT Is North America falling behind the rest of the world in HDI technology development? Not if Dan Smith can help it. "The New Mr. HDI" is putting together the first IPC HDI certification course and exam. We caught up with him and discussed the HDI course, what it takes to be an instructor and Happy Holden's 400-gig "data dump." http://www.flex007.com/pages/zone.cgi?a=70801 Thu, 26 Aug 2010 12:42:00 GMT Authors from Sandia National Laboratories investigate the solderability of current immersion Ag technology after exposure to conditions that simulate long-term storage followed by bake out environments prior to actual reflow assembly. http://www.flex007.com/pages/zone.cgi?a=55937 Wed, 25 Aug 2010 13:20:00 GMT Roy Porat, who has been with Camtek since 2001 serving in various positions in the United States and Asia, and for the past two years as General Manager of the company, is to succeed Rafi Amit as CEO. Amit will become Active Chairman of the Board of Directors. http://www.flex007.com/pages/zone.cgi?a=70815 Wed, 25 Aug 2010 10:36:00 GMT Die thickness of common, high-volume chip stacks range from 50 to 100 um while thinning industry aims for ultra-thin chips of 10 um thickness, or less. For the first time, the required interconnect length between vertically arranged adjacent chip layers has reached dimensions that can be reasonably realized by anisotropic conductive adhesives layers (ACA). http://www.flex007.com/pages/zone.cgi?a=70563 Tue, 24 Aug 2010 12:59:00 GMT The PCB industry in Asia is pulsing with activity. Shenzhen Fastprint is targeting production capability of up to 40-layer rigid multi-layer PCBs; KCE Electronics is aiming to grow its 2H revenue; and Wus Printed Circuit is now public. http://www.flex007.com/pages/zone.cgi?a=70715 Mon, 23 Aug 2010 13:13:00 GMT What is "rheology" and why does "everything flow?" Chet Guiles examines the science of rheology and how understanding the rheology of the prepregs you use, during the time they melt and flow, can help a process engineer manage and control the lamination process. http://www.flex007.com/pages/zone.cgi?a=70535 Mon, 23 Aug 2010 12:20:00 GMT Casey Cooper, Microelectronics Lab Manager at STI, talks about the company's various educational, training and technology offerings and provides an overview of the company's newly-developed and tested embedded die assembly. The new assembly is being evaluated by some military product developers for high-reliability applications. http://www.flex007.com/pages/zone.cgi?a=70690 Thu, 19 Aug 2010 13:34:00 GMT Interconnect separation is usually expressed as a crack that propagates at the internal interconnection. This failure mode produces a crack that is wedge-shaped, with the large end on the side of the foil closest to the middle of the PWB. An interconnect failure frequently develops slowly over time, accumulating damage at a constant rate after onset. http://www.flex007.com/pages/zone.cgi?a=70391 Wed, 18 Aug 2010 21:42:00 GMT PCBs sales in Germany slid in May, according to data from ZVEI PCB and Electronic Systems, but were still a 40% improvement from May of last year. Cumulatively, sales for the first five months of this year were up 32% and incoming orders also reached record highs in May, jumping 137% year-on-year. http://www.flex007.com/pages/zone.cgi?a=70630 Wed, 18 Aug 2010 09:53:00 GMT For several years technologies have been developed for the embedding of chips in circuit boards to achieve 3-D packages using conventional processes from PCB manufacturing. Ultra-thin chips are suited to be integrated in rigid circuit boards, as well as on, and in, multilayer flexible substrates. http://www.flex007.com/pages/zone.cgi?a=70240 Sun, 15 Aug 2010 12:06:00 GMT The sales increase was primarily due to increased sales of flex heater and coil insulation products for the general industrial market as a result of the economic rebound and increased sales of PCB materials related to the telecommunications infrastructure in China. http://www.flex007.com/pages/zone.cgi?a=70488 Sat, 14 Aug 2010 13:52:00 GMT Most manufacturers in Asia are embarking on technology and manufacturing upgrades: Lin Horn is increasing its manufacturing of six- and eight-layer PCBs; WMT is targeting 24-layer boards; Unimicron is focusing on 300-micron ball pitch; and Taiflex plans to increase its FCCL capacity. http://www.flex007.com/pages/zone.cgi?a=70553 Fri, 13 Aug 2010 14:00:00 GMT In this paper, authors from Endicott Interconnect show various organic optical waveguide samples using various fabrication methods. A detailed discussion of all the processes, materials and equipment sets that are employed in the fabrication of the organic optical waveguides are presented. http://www.flex007.com/pages/zone.cgi?a=70436 Tue, 10 Aug 2010 12:39:00 GMT This paper examines the thermal properties of various halogen-free laminates used in handheld electronic products and correlates these properties with manufacturing requirements. Thermal properties investigated include z-axis CTE, time to delamination at 260°C and 288°C and temperature to decomposition. http://www.flex007.com/pages/zone.cgi?a=70439 Tue, 10 Aug 2010 12:06:00 GMT "Our facilities are busy with solid backlogs and high levels of capacity utilization," said Kent Alder, President and CEO. "The added capacity and diversity of the Asia Pacific operations fits extremely well with our growth strategy as a global company." http://www.flex007.com/pages/zone.cgi?a=70387 Fri, 06 Aug 2010 13:47:00 GMT As frequencies get faster and designs get more complex, the electrical and thermal properties of PCBs are becoming a more critical factor in system designs. Many board developers don't realize that moisture in boards can significantly alter their performance. http://www.flex007.com/pages/zone.cgi?a=70275 Wed, 04 Aug 2010 13:32:00 GMT While RF purists may feel discomfort at the thought of using crosshatch as a high-frequency return, using crosshatched planes on flex and flex-rigid PCBs is a realistic method of keeping impedance-controlled traces at a manufacturable dimension and retaining the desired flexibility of the assembly. http://www.flex007.com/pages/zone.cgi?a=69843 Tue, 03 Aug 2010 12:50:00 GMT We all know the buzz words: impedance, 50 ohms, 10%, balanced lines, CTE, dielectric constant and loss and countless more. In this new series, PCB 101, I will break down some of these buzz words in layman's terms in the hopes that more people will understand what's happening inside the circuit. http://www.flex007.com/pages/zone.cgi?a=70133 Mon, 02 Aug 2010 12:26:00 GMT Mikel Williams, President and CEO, said, "With second quarter bookings of approximately $69.7 million and indications of continued solid demand in the marketplace, we are optimistic about our prospects for the second half of 2010." http://www.flex007.com/pages/zone.cgi?a=70186 Fri, 30 Jul 2010 13:00:00 GMT "By expanding our presence in Europe, Labtech is a welcome addition to our portfolio of businesses," said Russell Shaller, VP and GM of Teledyne MEC. "Coupled with our Teledyne Cougar microwave component business in the U.S., Labtech's component business augments our already strong position in the field of custom, high-performance microwave components." http://www.flex007.com/pages/zone.cgi?a=70161 Thu, 29 Jul 2010 15:31:00 GMT In this paper, the authors report novel printable materials with the potential to surpass conventional materials to produce fine structures compatible with organic substrates. Specifically, the electronic applications of printable materials are discussed, such as adhesives, inter-layer dielectrics, embedded passives and circuits. http://www.flex007.com/pages/zone.cgi?a=70058 Tue, 27 Jul 2010 12:09:00 GMT Solder-free and 3-D assembly will help bridge the performance and density gaps needed to extend Moore's Law, as lithography on silicon runs out of steam. It will offer America the chance to restore her electronic manufacturing mojo and provide for her security. Please, America, don't miss this chance to leap-frog the rest of the world! http://www.flex007.com/pages/zone.cgi?a=69967 Sun, 25 Jul 2010 12:46:00 GMT The company has begun its financial year with one of the best first quarter results in its history. The 14% increase in revenues meant not only a respectable pre-tax profit, but it was also substantially in excess both of AT&S forecasts and of market expectations. Revenues totalled EUR 114 million--37% higher than in the first quarter of 2009/10. http://www.flex007.com/pages/zone.cgi?a=69976 Thu, 22 Jul 2010 11:37:00 GMT According to Mark Thompson, timing can make or break your controlled impedance board. With many jobs going through turnkey environments, late communication about impedance issues takes valuable time out of the fabrication process and can delay delivery of product, leaving the end-user and the turnkey assembler unhappy. http://www.flex007.com/pages/zone.cgi?a=69913 Wed, 21 Jul 2010 13:51:00 GMT Materials are the most purchased items in the PCB industry for both business and technology customers. Material suppliers occupied the majority of the space at the show; however, many suppliers considered to be large players in the industry were absent. Why did they pass on this year's show? http://www.flex007.com/pages/zone.cgi?a=69842 Mon, 19 Jul 2010 14:07:00 GMT Viasystems Group, Inc, today announced that estimated consolidated sales for the quarter ended June 30, 2010 were $239.4 million, representing approximately $53 million, or 28%, sequential growth over $186.6 million sales reported for the previous quarter. This was also the fourth consecutive quarter of improvement in orders booked. http://www.flex007.com/pages/zone.cgi?a=69823 Mon, 19 Jul 2010 07:28:00 GMT Polar Instruments CEO Martyn Gaudion will be exploring a number of themes. A major SI topic that is set to grow is the emergence of new silicon families designed to push traditional materials into the multi-gigahertz arena. These new chipsets lift transmission speeds up to a point where signal losses rather than reflections become the predominant concern from an SI perspective. http://www.flex007.com/pages/zone.cgi?a=69779 Wed, 14 Jul 2010 15:26:00 GMT John Ritchie, Product Manager for Rogers Corporation, reviews his company's new high-frequency laminate product, RO4360, which features a Dk of 6.15. The new product can address issues concerning what Ritchie sees as three mega-trends in the industry: The drive toward mass transit, sustainable energy and Internet growth. http://www.flex007.com/pages/zone.cgi?a=59079 Wed, 14 Jul 2010 14:26:00 GMT Demands for higher performance, multifunctionality and size reduction require package substrates to offer improved high-speed signal transmission, higher wiring density and high system reliability. An SAP is widely used with build-up dielectric materials to form the circuit features. Features of such metallization processes are detailed here. http://www.flex007.com/pages/zone.cgi?a=59445 Tue, 13 Jul 2010 12:56:00 GMT IPC and Canon Communications have joined forces to produce Electronics Midwest, an exhibition and technical conference for the assembly and PCB design and manufacturing industries. Providing business and technology solutions that save time, energy and money, the event will bring the best of the global electronics industry together, September 28-30, 2010. http://www.flex007.com/pages/zone.cgi?a=69641 Mon, 12 Jul 2010 13:30:00 GMT The companies intend to establish a framework for research activities related to prototypes and products for security applications to be used in ports, airports, subways and rail stations by means of CBRN sensors, facial recognition systems, video enhancement technology, traffic monitoring systems and networking technology. http://www.flex007.com/pages/zone.cgi?a=69546 Sun, 11 Jul 2010 12:35:00 GMT