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LPKF Improves Fusion3D Performance
Wednesday, July 28, 2010 | LPKF

ScreenShot014.jpgLPKF Laser & Electronics has further optimized the Fusion3D laser for Laser Direct Structuring (LDS). With a few targeted steps LPKF was able to noticeably reduce structuring times for three-dimensional circuit boards with an expected increase of 10 to 20 percent; dependent on the component layout.

The increased speed is the result of a dramatically revised optics and laser control. Nils Heininger, VP of the LDS Business Division noted, "Highly dynamic components and optimized algorithms are resulting in short processing times and reduced unit costs." He emphasizes the aptness for a high level of product variability.

The LPKF Fusion3D won the prestigious HERMES Award in April 2010 and since last year has seen an increased demand from smaller production. Improvements on the laser head and reduction in cost are a welcome improvement on the unit.

About LPKF

LPKF Laser & Electronics AG manufactures machines and laser systems used in electronics fabrication, the automotive sector, and the production of solar cells. Around 20 percent of the workforce is engaged in research and development.


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