IPC - Association Connecting Electronics Industries presented Special Recognition, Distinguished Committee Leadership and Distinguished Committee Service awards at IPC Midwest Conference & Exhibition 2009, held September 20-24, 2009 in Schaumburg, Illinois.

The awards were presented to individuals who have made significant contributions to IPC and the electronics industry by lending their time and expertise to committees and standards and program development.

Special Recognition award recipients were: 

• Marg Drouin, Cirtronics Corporation, for her contributions to IPC Multimedia Training in providing materials, acting as technical advisor and input and review of scripts.
• Mike Freda, Sun Microsystems Inc., for his contributions to the IPC Executive Market and Technology Forum as a steering committee member and speaker.
• Mike Bryant, BGF Industries, Inc. and Silvio Bertling, Neltec, Inc., for their contributions to the development of a data-based value of permittivity/dielectric constant for E-glass in IPC-4412A, Specification for Finished Fabric Woven from "E" Glass for Printed Boards.
• Kathy Johnston, Raytheon Missile Systems, for her extraordinary contributions to the development of J-STD-001DS Revision A, Space Applications Electronic Hardware Addendum to J-STD-001D.
• Daniel Foster, Defense Acquisition Inc., for his training committee leadership and contributions to the development of J-STD-001DS Revision A, Space Applications Electronic Hardware Addendum to J-STD-001D.
• Jeannette Plante, NASA Goddard Space Flight Center, for her leadership and contributions to the development of J-STD-001DS Revision A, Space Applications Electronic Hardware Addendum to J-STD-001D.

Distinguished Committee Leadership awards went to:

• Antonio Senese, Panasonic Electric Works and Douglas Sober, Kaneka Texas Corporation for their leadership of the 3-11 Laminate/Prepreg Materials Subcommittee that developed IPC-4101C, Specification for Base Materials for Rigid and Multilayer Printed Boards.
• George Milad, Uyemura International Corporation and Gerard O'Brien, Solderability Testing & Solutions, Inc., for their leadership of the 4-14 Plating Processes Subcommittee that helped develop IPC-4553A, Specification for Immersion Silver Plating for Printed Boards.
• Michael Jouppi, Lockheed Martin, for leadership of the 1-10b Current Carrying Capacity Task Group that developed IPC-2152, Standard for Determining Current Carrying Capacity in Printed Board Design.
• Hue Green, Lockheed Martin Space Systems Company and Garry McGuire, NASA Marshall Space Flight Center, for leadership and contributions to the development of J-STD-001DS Revision A, Space Applications Electronic Hardware Addendum to J-STD-001D.