|  | Printable Materials and Devices for Electronic Packaging Tuesday, July 27, 2010 | Rabindra N. Das, How T. Lin, Jianzhuang Huang, John M. Lauffer, Frank D. Egitto, Mark D. Poliks and Voya R. Markovich, Endicott Interconnect Technologies, Inc. In this paper, the authors report novel printable materials with the potential to surpass conventional materials to produce fine structures compatible with organic substrates. Specifically, the electronic applications of printable materials are discussed, such as adhesives, inter-layer dielectrics, embedded passives and circuits.
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 |  | The Next Stage of Assembly: 3-D and Solder-Free Thursday, July 22, 2010 | Harvey Miller, Fabfile Online Solder-free and 3-D assembly will help bridge the performance and density gaps needed to extend Moore's Law, as lithography on silicon runs out of steam. It will offer America the chance to restore her electronic manufacturing mojo and provide for her security. Please, America, don't miss this chance to leap-frog the rest of the world!
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|  | EPTE Newsletter from Japan: JPCA Show 2010, Part VI Monday, July 12, 2010 | Dominique K. Numakura, DKN Research  JPCA exhibitors that featured printable electronics fell into three categories: Material suppliers, manufacturing equipment and tool vendors, and electronics circuit/device manufacturers. Most executives affiliated with JPCA agreed that printable electronics must be included in business plans going forward.
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|  | The Wasserzug Report: 2-8-9 Quoting System Tuesday, June 29, 2010 | Al Wasserzug - The Wasserzug Report At the IPC International Flex Circuit Conference, I spoke about the military and aerospace opportunities for flex circuit manufacturers. During my talk, I explained how the 2-8-9 Quoting System proves that price is not, and should not be, the sole differentiator for your customers.
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|  | EPTE Newsletter from Japan: JPCA Show 2010, Part IV Monday, June 28, 2010 | Dominique K. Numakura, DKN Research  Embedded components/circuit boards were one of the most popular technical topics talked about at the JPCA Show in several years. This year's show featured a special corner, called "Embedded Components Circuit Boards," where more than a dozen companies contributed by displaying samples and panels to promote their latest technologies.
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| | EPTE Newsletter from Japan: JPCA Show 2010, Part III Friday, June 18, 2010 | Dominique K. Numakura, DKN Research  Circuit board manufacturers seem hesitant to embrace the large electronics segment--probably because of the investment size needed to retool manufacturing lines. Unfortunately, the old adage is true: You have to spend money to make money.
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| | The Bare (Board) Truth: How to Qualify Your Fabricator Wednesday, June 16, 2010 | Mark Thompson, Prototron Circuits This column is written from the viewpoint of you, the customer. What should you look for when qualifying a fabricator? Sure, you want the company to be IPC Class 3 6012 capable and ISO-certified, and you may need them to be ITAR-certified as well. But what other criteria can help you separate the wheat from the chaff, so to speak?
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 |  | An Inside Look: EIPC Summer Conference 2010, Day One Wednesday, June 16, 2010 | Pete Starkey, I-Connect007 Couldn't make it to the recent EIPC Conference in Nuremberg? No worries: Feel as though you were right there, in the audience, with our European Editor Pete Starkey's in-depth review of the many presentations made during the two-day event, presented in conjunction with SMT/HYBRID/PACKAGING.
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|  | Reid on Reliability: PWB Barrel Cracks--Accelerating Failure Monday, June 07, 2010 | Paul Reid, PWB Interconnect Solutions With mission-critical, high-reliability PCBs, the study of barrel cracks is critical. When the failure criteria are set at 10% increase in resistance, a powerful method can be used. Paul Reid explains why stopping at 10% allows us to observe a ripening failure "dripping" with information, rather than a catastrophically failed circuit that is significantly deformed.
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