 |
FIND IT FAST |
 |
RESOURCE LINKS |
|
| 54073 Records Searched | 7809 Matches |
 | |  |
| | I-Connect007's PCB Asia Week: Upbeat Industry Friday, September 03, 2010 | L. Las Marias, Manila, I-Connect007 In this week's PCB Asia Week, the PCB industry looks very active, with companies such as TECHWISE Circuits increasing their technical know-how, while others, including TUC, ramp up their exports. Chunghong, on the other hand, is raising capital through a listing on the TSE.
|
|  | Northstar Receives Additional Purchase Order from Lockheed Martin Friday, September 03, 2010 | Business Wire Northstar Electronics, Inc. today announced that its wholly owned subsidiary, Northstar Network Ltd., has received a revised Master Purchase Order from Lockheed Martin to increase the value of NNL's P-3 contract by US $9.1 million, to a total of US $16.4 million.
|
|  | HP Eyes #2 Spot in Netbook Market in 2011 Friday, September 03, 2010 | Digitimes HP is set to start pushing netbooks strongly and plans to become the second-largest netbook brand in 2011, surpassing Samsung Electronics and Asustek Computer.
|
| | Fabricators Trim NB PCB Shipment Outlook for Q3 Friday, September 03, 2010 | Digitimes HannStar Board has revised its shipment guidance for notebook PCBs from growth to decline for the third quarter of 2010, while peer companies, including Gold Circuit Electronics, Tripod Technology and Dynamic Electronics, also expressed conservative views over third-quarter shipment outlooks.
|
| | Getting PCB Manufacturing Services Online Friday, September 03, 2010 | Boosh News The PCB manufacturing industry is growing in leaps and bounds. This has led PCB manufacturers, distributors and suppliers to launch competitive services to attract more customers via an online presence.
|
|  | Cire Group Files for Insolvency Thursday, September 02, 2010 | I-Connect007 "Since no positive conclusion has been reached in its attempts to renegotiate its debts and finance its last investments, Cire Group had to be filed for insolvency on August 3, 2010."
|
|  | Tyre Pressure Monitoring Systems & Energy Harvesting Friday, September 02, 2010 | IDTechEx Although the first tyre pressure monitoring systems (TPMS) appeared in the mid-80's as a feature of top-range luxury vehicles, it is only in recent years that they have seen widespread adoption worldwide. Most drivers in the USA must recognize the symbol below, a warning light incorporated in dashboards of all new vehicles after 2007 (although phase in started in 2005), that informs drivers on whether tire pressure is getting dangerously low.
|
|  | BAE Systems to Develop On-Board Processor, Integrate DARPA's ARGUS-IR Thursday, September 02, 2010 | BUSINESS WIRE After successful development of the Defense Advanced Research Projects Agency's (DARPA) daytime persistent surveillance system, BAE Systems has been awarded an additional $49.9 million contract to develop the advanced processor for the agency's nighttime, infrared system - the Autonomous Real-time Ground Ubiquitous Surveillance - Infrared (ARGUS-IR).
|
|  | Russia Defence and Security Report 4Q10 Thursday, September 02, 2010 | BUSINESS WIRE Research and Markets has announced the addition of the "Russia Defence and Security Report Q4 2010" report to their offering.
|

|
 | |  |
| | I-Connect007's PCB Asia Week: Upbeat Industry Friday, September 03, 2010 | L. Las Marias, Manila, I-Connect007 In this week's PCB Asia Week, the PCB industry looks very active, with companies such as TECHWISE Circuits increasing their technical know-how, while others, including TUC, ramp up their exports. Chunghong, on the other hand, is raising capital through a listing on the TSE.
|
 |  | Enthone Introduces ENTEK OM PWB Final Finish Thursday, September 02, 2010 | Enthone Enthone Inc., a business of Cookson Electronics, has introduced ENTEK OM. The patented Organic Metal process delivers a visible, highly conductive PWB final finish that offers both ease of inspection and in-circuit testing (ICT).
|
| | Optimizing BNC PCB Footprints for Digital Video Equipment Wednesday, September 01, 2010 | Tsun-kit Chin, National Semiconductor Today's video equpment operates at gigabit rates, necessitating the use of large coaxial BNC connectors. Non-optimized BNC footrpints can cause impedance mismatches, reflections and signal loss. In this paper, Tsun-kit Chin of National Semiconductor discusses some common issues with BNC footprints, such as problems with the connector-to-board transition, and offers techniques for transparent footprint designs.
|
| | Software Bytes: The Reality Behind Customer Support Wednesday, September 01, 2010 | Abby Monaco, CID, Intercept Technology We live in a service-driven society. It's a big market out there, and we can accept or reject products or services as we see fit. So, it's really darn important for a company selling a product or service to provide customer service at a standard that meets (or exceeds) the consumer's expectations.
|
|  | Nanotechnology for Lead-Free Final Finishes with Organic Metal Tuesday, August 31, 2010 | Jim Kenny, B. Wessling, Karl Wengenroth, Joe Abys, John Fudala, Robert Farrell, Enthone Enthone's research has focused on providing a solderable surface finish for PCBs containing organic nanometal. The first universal nanofinish was proposed four years ago. Now, the new-generation nanofinish with organic metal-Ag complex performs as well as any other surface finish with regard to aging resistance, discoloration and solderability.
|
|  | July Chip Sales Up 37% YoY Monday, August 30, 2010 | Business Wire Global sales of semiconductors grew to $25.2 billion in July, an increase of 1.2% from June when sales were $24.9 billion and an increase of 37% from July 2009 when sales were $18.4 billion, the SIA reported. Year-to-date sales total $169.2 billion, an increase of 46.7% from the $115.3 billion reported for the first seven months of 2009.
|
|  | Cicor's PCB Segment Posts 27% Revenue Growth in 1H Friday, August 27, 2010 | Cicor Technologies Compared to the previous year, the PCB Division increased its net proceeds during the period by 27.3% to CHF 17.8 million (first half of 2009: CHF 14.0 million); During the period, the ES Division achieved net proceeds of CHF 44.8 million (first half of 2009: CHF 41.5 million).
|
 |  | The Shaughnessy Report: HDI Class Q&A with Dan Smith Tuesday, August 24, 2010 | Andy Shaughnessy, PCBDesign007 Is North America falling behind the rest of the world in HDI technology development? Not if Dan Smith can help it. "The New Mr. HDI" is putting together the first IPC HDI certification course and exam. We caught up with him and discussed the HDI course, what it takes to be an instructor and Happy Holden's 400-gig "data dump."
|
|  | Effects of Storage Procedures and Bake Out on Solderability of Immersion Silver-Coated PCBs Tuesday, January 19, 2010 | Paul Vianco, Edwin Lopez, William Wallace, Alice Kilgo, and Samuel Lucero - Sandia National Laboratories Authors from Sandia National Laboratories investigate the solderability of current immersion Ag technology after exposure to conditions that simulate long-term storage followed by bake out environments prior to actual reflow assembly.
|
 |  | Camtek Appoints New CEO Wednesday, August 25, 2010 | PR Newswire Roy Porat, who has been with Camtek since 2001 serving in various positions in the United States and Asia, and for the past two years as General Manager of the company, is to succeed Rafi Amit as CEO. Amit will become Active Chairman of the Board of Directors.
|

|
 | |  |
| | Optimizing BNC PCB Footprints for Digital Video Equipment Wednesday, September 01, 2010 | Tsun-kit Chin, National Semiconductor Today's video equpment operates at gigabit rates, necessitating the use of large coaxial BNC connectors. Non-optimized BNC footrpints can cause impedance mismatches, reflections and signal loss. In this paper, Tsun-kit Chin of National Semiconductor discusses some common issues with BNC footprints, such as problems with the connector-to-board transition, and offers techniques for transparent footprint designs.
|
| | Software Bytes: The Reality Behind Customer Support Wednesday, September 01, 2010 | Abby Monaco, CID, Intercept Technology We live in a service-driven society. It's a big market out there, and we can accept or reject products or services as we see fit. So, it's really darn important for a company selling a product or service to provide customer service at a standard that meets (or exceeds) the consumer's expectations.
|
|  | Nanotechnology for Lead-Free Final Finishes with Organic Metal Tuesday, August 31, 2010 | Jim Kenny, B. Wessling, Karl Wengenroth, Joe Abys, John Fudala, Robert Farrell, Enthone Enthone's research has focused on providing a solderable surface finish for PCBs containing organic nanometal. The first universal nanofinish was proposed four years ago. Now, the new-generation nanofinish with organic metal-Ag complex performs as well as any other surface finish with regard to aging resistance, discoloration and solderability.
|
 |  | The Shaughnessy Report: HDI Class Q&A with Dan Smith Tuesday, August 24, 2010 | Andy Shaughnessy, PCBDesign007 Is North America falling behind the rest of the world in HDI technology development? Not if Dan Smith can help it. "The New Mr. HDI" is putting together the first IPC HDI certification course and exam. We caught up with him and discussed the HDI course, what it takes to be an instructor and Happy Holden's 400-gig "data dump."
|
|  | Effects of Storage Procedures and Bake Out on Solderability of Immersion Silver-Coated PCBs Tuesday, January 19, 2010 | Paul Vianco, Edwin Lopez, William Wallace, Alice Kilgo, and Samuel Lucero - Sandia National Laboratories Authors from Sandia National Laboratories investigate the solderability of current immersion Ag technology after exposure to conditions that simulate long-term storage followed by bake out environments prior to actual reflow assembly.
|
| | Material Witness: Rheology, Part I Monday, August 16, 2010 | Chet Guiles, Arlon Consultant What is "rheology" and why does "everything flow?" Chet Guiles examines the science of rheology and how understanding the rheology of the prepregs you use, during the time they melt and flow, can help a process engineer manage and control the lamination process.
|
| | Flexible Thinking: Flexible Structures for Data Transmission Thursday, August 12, 2010 | Joe Fjelstad, Verdant Electronics Flexible circuit cables offer some significant advantages for facilitating the movement of data between elements of a system that must also be moved or flexed. However, there is a balancing act involved and there is more than one master to be served to create a system that is robust, reliable and easily manufacturable.
|
| | The Pulse: Zen and the Art of Accurate Impedance Measurement Thursday, August 11, 2010 | Martyn Gaudion, Polar Instruments In "Zen and the Art of Motorcycle Maintenance," Robert M. Prisig contrasts his regular and ongoing daily approach to motorcycle maintenance with his friend's alternate view of leaving well enough alone between service center-based maintenance. What has this got to do with accurate impedance measurement, you may ask? Read on!
|
|  | Embedded Die Assembly for High-Rel Applications Thursday, August 19, 2010 | Real Time With...IPC APEX Expo 2010  Casey Cooper, Microelectronics Lab Manager at STI, talks about the company's various educational, training and technology offerings and provides an overview of the company's newly-developed and tested embedded die assembly. The new assembly is being evaluated by some military product developers for high-reliability applications.
|
| | Reid on Reliability: Interconnect Separation Anxiety Wednesday, August 11, 2010 | Paul Reid, PWB Inc. Interconnect separation is usually expressed as a crack that propagates at the internal interconnection. This failure mode produces a crack that is wedge-shaped, with the large end on the side of the foil closest to the middle of the PWB. An interconnect failure frequently develops slowly over time, accumulating damage at a constant rate after onset.
|

|
 | |  |
| | Software Bytes: The Reality Behind Customer Support Wednesday, September 01, 2010 | Abby Monaco, CID, Intercept Technology We live in a service-driven society. It's a big market out there, and we can accept or reject products or services as we see fit. So, it's really darn important for a company selling a product or service to provide customer service at a standard that meets (or exceeds) the consumer's expectations.
|
 |  | The Shaughnessy Report: HDI Class Q&A with Dan Smith Tuesday, August 24, 2010 | Andy Shaughnessy, PCBDesign007 Is North America falling behind the rest of the world in HDI technology development? Not if Dan Smith can help it. "The New Mr. HDI" is putting together the first IPC HDI certification course and exam. We caught up with him and discussed the HDI course, what it takes to be an instructor and Happy Holden's 400-gig "data dump."
|
| | Material Witness: Rheology, Part I Monday, August 16, 2010 | Chet Guiles, Arlon Consultant What is "rheology" and why does "everything flow?" Chet Guiles examines the science of rheology and how understanding the rheology of the prepregs you use, during the time they melt and flow, can help a process engineer manage and control the lamination process.
|
| | Flexible Thinking: Flexible Structures for Data Transmission Thursday, August 12, 2010 | Joe Fjelstad, Verdant Electronics Flexible circuit cables offer some significant advantages for facilitating the movement of data between elements of a system that must also be moved or flexed. However, there is a balancing act involved and there is more than one master to be served to create a system that is robust, reliable and easily manufacturable.
|
| | The Pulse: Zen and the Art of Accurate Impedance Measurement Thursday, August 11, 2010 | Martyn Gaudion, Polar Instruments In "Zen and the Art of Motorcycle Maintenance," Robert M. Prisig contrasts his regular and ongoing daily approach to motorcycle maintenance with his friend's alternate view of leaving well enough alone between service center-based maintenance. What has this got to do with accurate impedance measurement, you may ask? Read on!
|
| | Reid on Reliability: Interconnect Separation Anxiety Wednesday, August 11, 2010 | Paul Reid, PWB Inc. Interconnect separation is usually expressed as a crack that propagates at the internal interconnection. This failure mode produces a crack that is wedge-shaped, with the large end on the side of the foil closest to the middle of the PWB. An interconnect failure frequently develops slowly over time, accumulating damage at a constant rate after onset.
|
| | Trouble in Your Tank: Flexible Metalization, Part II Monday, July 22, 2010 | Michael Carano, OMG Electronic Chemicals When electroless copper is deposited on the polyimide substrates used for flex and rigid-flex circuits, adhesion must not be compromised. The goal is to minimize stress (both compressive and tensile) to the best extent possible. The first critical factor is the control of the copper deposition rate.
|
| | New Column: PCB 101 Wednesday, July 28, 2010 | Robert Tarzwell, DMR Ltd. We all know the buzz words: impedance, 50 ohms, 10%, balanced lines, CTE, dielectric constant and loss and countless more. In this new series, PCB 101, I will break down some of these buzz words in layman's terms in the hopes that more people will understand what's happening inside the circuit.
|
 |  | The Next Stage of Assembly: 3-D and Solder-Free Thursday, July 22, 2010 | Harvey Miller, Fabfile Online Solder-free and 3-D assembly will help bridge the performance and density gaps needed to extend Moore's Law, as lithography on silicon runs out of steam. It will offer America the chance to restore her electronic manufacturing mojo and provide for her security. Please, America, don't miss this chance to leap-frog the rest of the world!
|
|  | Timing is Everything in Controlled Impedance Fabrication Tuesday, July 20, 2010 | Mark Thompson, CID, Prototron Circuits According to Mark Thompson, timing can make or break your controlled impedance board. With many jobs going through turnkey environments, late communication about impedance issues takes valuable time out of the fabrication process and can delay delivery of product, leaving the end-user and the turnkey assembler unhappy.
|

|
|
|
|
|
|